High Reliability PCB

  • Multilayer up to 60+ layers
  • Embedded passives
  • Heavy copper up to 10 oz.
  • Over 50 UL approved laminates
  • Thickness up to 0.450″
  • Thin core dielectrics
  • Dimensions up to 30″ x 54″
  • Mixed dielectrics

PCB Thermal Management

  • Passive and active designs
  • Buried metal core constructions
  • Externally mounted heatsinks
  • Epoxy and B-stage films
  • Thermal & conductive bonding
  • Aluminum & copper base materials
  • Various surface finishes
  • In-house milling and bonding

HDI PCB

  • Blind & Buried Vias
  • Up to 12L “any-layer” stacked uVia Structure
  • 1.6/2.0 mil line / spaceWide material & surface finish selections
  • 14 mil, 6L ultra thin structure
  • 3/7 mil uVia / Pad size0.4 mm pitch BGA with 2 traces fanout
  • Embedded, distributed and discrete passive components

RF & Microwave

  • High frequency and bandwidth designs
  • Planar and screened resistors
  • Dimensions up to 24″ x 48″
  • Mixed dielectrics (hybrids)
  • Dielectric foam
  • Conductive paste
  • Plated cavities
  • Formed (conformal) PCBs
  • Optical machining

Flex & Rigid-Flex

  • Type 2, 3 and 4
  • Double sided, multilayer and Rigid flex
  • 30+ layers
  • Dimensions up to 24″ x 48″
  • Acrylic, epoxy and adhesive-less polyimide flex materials
  • Over 50 rigid material options
  • Thickness up 0.300″
  • Bikini cut, bookbinder, loose leaf construction

IC Substrates

  • 2,4,6 Layers (2+2+2 stacked via)
  • BT material
  • Wire bonding types
  • ENEPIG
  • Soft/Hard gold
  • IC Substrate Type:
  • SIP, CSP, BOC & FC package
  • Fine trace width/space 25/25um
  • Thin board: 130um(2L), 170um(4L)
  • Flip chip C4 pad

Address-Plot No. 36, Phase-III, Kamalapuri Colony, Hyderabad, Telangana-500073, India.

Ph: +91-7093535378, +1-408-600-1453 sales@cerrasystems.com